EPIC Community Member:
Bay Photonics offer open access to skills and services for Photonic Integrated Circuit (PIC) assembly and packaging. The objective is to reduce their customer’s investment in direct costs for packaging design and assembly of proof of concept, prototypes, pre-production and production PICs.
Bay Photonics have deep engineering expertise in many business sectors.
Bay Photonics' knowledge of packaging solutions helps customers through their complete project life cycle from design, prototyping, new product introduction, test, volume manufacturing and transfer to low-cost volume manufacture, either onshore or offshore.