EPIC Community Member:
Bay Photonics offer open access to skills and services for Photonic Integrated Circuit (PIC) assembly and packaging. The objective is to reduce their customer’s investment in direct costs for packaging design and assembly of proof of concept, prototypes, pre-production and production PICs.
Bay Photonics' knowledge of packaging solutions helps customers through their complete project life cycle from design, prototyping, new product introduction, test, volume manufacturing and low volume manufacture.
Bay Photonics specialise in providing photonic packaging, optical assembly, hermetic sealing & connectivity solutions, from basic emitter/detector semiconductor chip die-attach and wire-bonding through to the design and establishment of a manufacturing process for complex electro-optic and quantum subsystems. Bay build optomechanical modules that require a flexible and technically innovative approach to assembly and test for the quantum, communications, metrology and sensing markets and examples of our designs can be found in LIDAR systems, photonic integrated circuits (PICs), narrow-linewidth lasers, SLDs, SPADs, single photon sources, free space communications systems, and space-based sensors. Bay utilise state-of-the-art manufacturing workstations located within their facility offering reduced time to market, reduced technical risk and clear roadmap to low cost manufacture.